Air Products and Chemicals, Inc.
Inert Wave Soldering Technology tell me more

Technical Paper Download

Thank you for your interest in our technical paper, “Effects of Solder Reflow Conditions on the Assembly of Electronics Packaging and Printed Circuit Boards.” To download your FREE copy, please complete the form below.

* denotes required fields

Name: *
Company: *
Address: *
City/State: *
Phone: *
Email: *

← Back to Site